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タイトル: ニッケル電着時の水素透過に及ぼす添加剤の影響
その他のタイトル: Effect of Addition Agents on Hydrogen Permeation into Steel Substrate During Plating
著者: 坂本, 芳一 / 丸田, 明 / 高尾, 慶蔵
著者(別表記) : Sakamoto, Yoshiichi / Maruta, Akira / Takao, Keizo
発行日: 1980年 2月
出版者: 長崎大学工学部 / Faculty of Engineering, Nagasaki University
引用: 長崎大学工学部研究報告, (14), pp.95-102; 1980
抄録: The effect of brightners added to Watt's nickel plating bath on the permeation of hydrogen through steel substrate during plating was investigated by means of an electrochemical permeation technique. The additions of 1,5 naphthalene disulfonic acid, o-benzosulfimide, sodium formate, thiourea, Cu and Fe (III) etc., increase the hydrogen permeation with the amount of their agents, while additions of p-toluenesulfone amide, formalin, Cd, Fe (II), Co, Se and S etc., when present in relatively small concentrations have a marked effect in increasing hydrogen entry during plating. The additions of propagyl alcohol, gelatin and Zn etc., do not affect a remarkable change on the permeation. The nickel deposits from baths contained these additives have relatively a high porosity. The apparent correspondences among the behavior of hydrogen permeation, current efficiency, lattice parameter and half value breadth of x-ray diffraction line of the deposits are not necessarily observed.
URI: http://hdl.handle.net/10069/23972
ISSN: 02860902
資料タイプ: Departmental Bulletin Paper
原稿種類: publisher

引用URI : http://hdl.handle.net/10069/23972



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