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Electroplated Fe films prepared from a deep eutectic solvent

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Title: Electroplated Fe films prepared from a deep eutectic solvent
Authors: Yanai, Takeshi / Shiraishi, K. / Shimokawa, Takaya / Watanabe, Y. / Ohgai, Takeshi / Nakano, Masaki / Suzuki, K. / Fukunaga, Hirotoshi
Issue Date: 7-May-2014
Publisher: American Institute of Physics Inc.
Citation: Journal of Applied Physics, 115(17), 17A344; 2014
Abstract: Electroplating of Fe films was carried out from choline chloride-ethylene glycol types of DES (Deep Eutectic Solvent). We investigated magnetic properties of the plated Fe films and evaluated the productivity for the electroplating process. Consequently, we found that surface morphology and current efficiency of the plated films were affected by the bath temperature. We obtained the Fe films with relatively smooth surface and high current efficiency in the bath temperature range from 70 to 110°C. The deposition rate for our process depended on the current density, and we obtained high deposition rate value of approximately 120μm/h. We also obtained high current efficiency values of approximately 90% in the wide range of plating time. These results indicate that the DES-based bath has industrial advantages for mass-producing Fe films. Therefore, we conclude that the DES-based bath is an attractive plating bath for Fe films.
URI: http://hdl.handle.net/10069/34646
ISSN: 00218979
DOI: 10.1063/1.4870319
Rights: © 2014 American Institute of Physics. This article may be downloaded for personal use only. Any other use requires prior permission of the author and the American Institute of Physics. The following article appeared in Journal of Applied Physics, 115(17), art. no. 17A344; 2014 and may be found at http://dx.doi.org/10.1063/1.4870319
Type: Journal Article
Text Version: publisher
Appears in Collections:Articles in academic journal

Citable URI : http://hdl.handle.net/10069/34646

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