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Nd-Fe-B film magnets with the thickness above 100 μm deposited on Si substrates

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Title: Nd-Fe-B film magnets with the thickness above 100 μm deposited on Si substrates
Authors: Nakano, Masaki / Chikuba, Y. / Oryoshi, M. / Yamashita, A. / Yanai, Takeshi / Fujiwara, R. / Shinshi, T. / Fukunaga, Hirotoshi
Issue Date: 14-Jul-2015
Publisher: IEEE
Citation: 2015 IEEE Magnetics Conference (INTERMAG), 7156598; 2015
Abstract: Although increase in thickness of an Nd-Fe-B film magnet is indispensable to provide a sufficient magnetic field, it was difficult to suppress the peeling phenomenon due to the different values of a linear expansion coefficient for a Si substrate and a Nd-Fe-B film even if a buffer layer such as a Ta film was used. In this report, it was confirmed that a control of the microstructure for PLD (Pulsed Laser Deposition)-fabricated Nd-Fe-B films enabled us to increase the thickness up to approximately 160 μm without a buffer layer on a Si substrate. Namely, we found that the precipitation of Nd element at the boundary of Nd-Fe-B grains together with the triple junctions due to the composition adjustment is effective to suppress the destruction of the samples through an annealing process. The magnetic properties of the prepared films were comparable to those of previously reported ones deposited on metal substrates. Although the mechanism is under investigation, the above-mentioned film had stronger adhesive force compared with that of a sputtering-made film. Resultantly, no deterioration of mechanical together with magnetic properties could be observed after a dicing process.
Description: 2015 IEEE International Magnetics Conference, INTERMAG 2015; Beijing; China; 11 May 2015 through 15 May 2015
Keywords: Nd-Fe-B, film magnet / Si substrate / PLD (Pulsed Laser Deposition) / MEMS
URI: http://hdl.handle.net/10069/35908
ISBN: 9781479973217
DOI: 10.1109/INTMAG.2015.7156598
Rights: © 2015 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
Type: Conference Paper
Text Version: author
Appears in Collections:Conference Paper

Citable URI : http://hdl.handle.net/10069/35908

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