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タイトル: 複雑形状の微細切断の研究(第1報)-基本原理と基礎実験装置開発-
その他のタイトル: A basic study on precision cutting of free form using diamond abrasive wire - Proposal of concept and development of prototype unit for initial experiments -
著者: 矢澤, 孝哲 / 峯田, 航 / 扇谷, 保彦 / 小島, 龍広 / 石川, 圭一
著者(別表記) : Yazawa, Takanori / Mineta, Kou / Ougiya, Yasuhiko / Kojima, Tatsuhiro / Ishikawa, Keiichi
発行日: 2006年 9月
出版者: 長崎大学工学部
引用: 長崎大学工学部研究報告 = Reports of the Faculty of Engineering, Nagasaki University vol.36(67) p.1-5 2006
抄録: Recently, many cut off processes are research and development. In the production process such as the silicon wafer or the crystal resonator, the multi-wire saw is often used. But, the cut off in free form is difficult by this method. In the case of free form cutting, wire EDM, laser cutting and waterjet machining are properly used by work material and work thickness, etc. In other words, the wire EDM is not adapted for non-conducting material, and it is difficult by the laser cutting and the waterjet machining that the thick workpiece is cut off with thin cutting width. So, the author proposes free form cut off method using diamond abrasive wire for non-conductive material such as optical glass. In this research, concept of proposal method and development of cut off unit for initial experiment are reported.
キーワード: Wire saw / Diamond abrasive wire / Free form cut off
URI: http://hdl.handle.net/10069/4971
ISSN: 18805574
関連リンク : http://www.lb.nagasaki-u.ac.jp/reports/kougaku/preview.php?id=28
資料タイプ: Departmental Bulletin Paper
出現コレクション:第36巻 第67号

引用URI : http://hdl.handle.net/10069/4971



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